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ROHM Co., Ltd.
Posted Date:
June 10, 2026
ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
ROHM Co., Ltd.
June 10, 2026
ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
ROHM Co., Ltd.
June 8, 2026
